• 专利附录
  • 专利说明
  • 权利要求
  • 类似技术
  • 同族专利
  • 引用文献
  • 法律状态
  • 优先权
    • 专利摘要:
    The invention relates to a method of manufacturing a smart card. According to this method, there is provided: - on the one hand, a module comprising a substrate supporting contacts, on one side, as well as conductive tracks and a chip on the other, - on the other hand, an antenna (200) on a support, the antenna comprising a connection pad (220) respectively at each of its ends. A solder drop (230) is disposed on each of the connection pads (220) of the antenna (200). Then, the antenna support (200) is embedded between layers of plastic material leaving a cavity (400) free in which the module can be housed and in which the connection pads (220) of the antenna (200) and its solder drops (230) remain accessible. A module is then placed in each cavity (400). The regions of the module at the level of the solder drops (230) are then heated to melt the solder and solder the connection pads (220) of the antenna (200) to conductive tracks of the module.
    公开号:FR3026529A1
    申请号:FR1459310
    申请日:2014-09-30
    公开日:2016-04-01
    发明作者:Eric Eymard
    申请人:Linxens Holding SAS；
    IPC主号:
    专利说明:

    [0001] A method of manufacturing a smart card and a smart card obtained by this method. The invention relates to the field of smart cards. Smart cards are well known to the public, which has multiple uses: payment cards, SIM cards for mobile phones, transport cards, identity cards, etc. The smart cards comprise transmission means for transmitting data from an electronic chip (integrated circuit) to a card reader device (reading) or from this device to the card (writing). These transmission means can be "contact", "non-contact" or double-interface when they combine the two previous means. The invention makes it possible to produce, in particular, double-interface smart cards. Dual interface smart cards are called "dual" if the "contact" and "contactless" modes are managed by a single chip or "hybrids" if the "contact" and "contactless" modes are managed by two physically distinct chips. The dual-interface smart cards generally consist of a rigid plastic support of the PVC, PVC / ABS, PET or polycarbonate type constituting the bulk of the card, in which are incorporated an electronic module and an antenna manufactured separately. . The electronic module comprises a generally flexible printed circuit board equipped with an electronic chip and contact pads electrically connected to the chip and flush with the electronic module, on the surface of the support, for connection by electrical contact with a card reader device. The dual-interface chip cards further include at least one antenna for transmitting data between the chip and a radio frequency system for reading or writing contactless data. In the prior art, the electronic module comprising the contacts and the chip, on the one hand, and the antenna optionally integrated with a support ("inlay" 30 in the English terminology), on the other hand, are generally manufactured separately, then the antenna is connected to the module on which is mounted and connected the chip. The connection between the antenna and the module is carried out according to complex processes that negatively impact the productivity, the manufacturing yields and the reliability of the cards during their use. An object of the invention is to simplify and make reliable this type of process. This goal is at least partly achieved by a method of manufacturing a smart card, comprising: providing a smart card module having a substrate having first and second major faces, with on the first face of the substrate, contacts for a temporary electrical connection with a card contact reading device, and on the second face of the substrate, conductive tracks, this module also being provided with an electronic chip connected to at least some contacts and at least two conducting tracks dedicated to an antenna connection, producing an antenna on an antenna support for electromagnetic coupling with a non-contact card reading device, the antenna comprising a connection pad at each of its ends, respectively, the lamination of the antenna support between layers of plastic material, and the placing of the module in a cavity provided with at least some of the layers of plastic, characterized in that it further comprises - the deposition of solder drops on each of the connection pads of the antenna and the heating of these drops, once the module in place 25 in the cavity, in order to weld each of the conductive tracks of the module dedicated to an antenna connection respectively with a connection pad. The solder drop deposit on the connection pads of the antenna makes it possible to produce a product ("inlay" with an antenna) which can be marketed as such in order to be embedded in plastic layers and connected to a module. mounted in the map later. This product is ready to use and facilitates the operations of the card manufacturer. Indeed, this card manufacturer only has to assemble elements ("inlay" with an antenna, module and plastic sheets) optionally provided separately. The operation of connecting the module to the antenna is greatly simplified by the use of the solder already in place on the connection pads of the antenna. In addition, this operation can be concomitant with that of sticking the module in its cavity, using a heat-reactive adhesive, a single heating operation then being necessary to both connect the module to the antenna is fix the module in its cavity. Alternatively, the solder drops are deposited on the conductive tracks of the module dedicated to the connection of the antenna, or else both on the conductive tracks of the module dedicated to the connection of the antenna and on the pads. connection. The process according to the invention optionally comprises one or the other of the following characteristics taken separately or in combination: the solder drops consist, for example, of a material having a melting temperature of between 120 ° C. and 230 ° C. ° C, and more preferably between 160 ° C and 190 ° C; the heating of the solder drops is, for example, carried out by applying to the module a temperature of between 120 ° C. and 250 ° C .; - The plastic layers are, for example, PVC. The process according to the invention can be carried out continuously ("real-to-reel" according to the English terminology). According to another aspect, the invention is a chip card comprising a chip card module comprising a substrate having first and second main faces, with on the first face of the substrate, contacts for a temporary electrical connection with a device. with the card contacts being read, and on the second face, conductive tracks, this module also being provided with an electronic chip connected to at least some contacts and at least two conductive tracks dedicated to an antenna connection; antenna on an antenna support for electromagnetic coupling with a non-contact card reading device, the antenna comprising a connection pad respectively at each of its ends, the antenna support being laminated between layers of plastic material , and the module being housed in a cavity formed in at least some of the plastic layers, characterized in that it comprises in addition, a drop of solder between each of the two conductive tracks dedicated to an antenna connection and each of the connection pads of the antenna.
    [0002] According to yet another aspect, the invention is a structure for a smart card comprising an antenna, for an electromagnetic coupling with a non-contact card reading device, on a support, characterized in that each of the ends of the antenna comprises a connection pad provided with a drop of solder.
    [0003] Other features and advantages of the invention will become apparent on reading the detailed description and the accompanying drawings, in which: FIG. 1 is a diagrammatic perspective view of the stacking of the layers constituting a set of smart cards according to FIG. invention; FIG. 2 diagrammatically represents an antenna support band portion; FIG. 3 schematically represents an enlargement of an area of the band of FIG. 2 comprising an antenna; FIG. 4 schematically represents in transparency a zone cut in a layer placed on the zone of FIG. 3; Figure 5 schematically shows an enlargement of the cut-out area of Figure 4; - Figure 6 schematically shows in transparency the cut area of Figures 3 and 4, with a module housed in this cut area; FIG. 7 is a diagrammatic sectional view of an example of a smart card obtained by the method according to the invention; - Figure 8 schematically shows an enlargement of the smart card of Figure 7; and FIG. 9 represents another example of a smart card obtained by the method according to the invention. According to one embodiment of the smart card manufacturing method according to the invention, on the one hand, modules 100 and antennas 200 are produced on a support 210 (see FIG. 1). As shown in FIG. 6, each module 100 is produced, for example in a known manner, on a double-sided substrate 101 having contacts 102, on one face (called "contact face" or "front face"), as well as tracks 110 and an electronic chip 120, on the other 10 (called "back face" or "face bonding"). The attachment of the electronic chip 120 on the substrate 101 is performed by at least one known technique such as die-attach ("die-attach") and its electrical connection to the contacts 102 and the conductive tracks 110 is carried out by at least one known technique such as flip-chip technology, wire-bonding, and the like. . The chip 120 and its possible wire connections to the contacts 102 and to the conductive tracks 110 are advantageously protected by encapsulation in a resin ("globe top" or "dam & fill" according to the English terminology, corresponding to a UV or thermal encapsulation ). The chip being placed on the rear face of the substrate or in a cutout made in it, the encapsulation is carried out from this rear face and can form an extra thickness with respect thereto, over a certain area that the we will name "encapsulation zone". The antenna 200 is also made, for example in known manner, on a double-sided substrate with metallized connection wells between the ends of the antenna on one side of the support 210 and connection pads 220 made on the other face (see Fig. 3). A solder drop 230 is disposed on each of the connection pads 220 of the antenna. Each solder drop 230, once deposited on a connection pad 220 and before the heating operation to achieve the welding between the antenna 200 and the module 100, forms a dome having a height of 0.3 mm.
    [0004] Then, the antenna support 210 is laminated between plastic layers (PVC for example) 300, 310, 320, 330, 340 leaving cavities 400 free in each of which a module 100 can be housed. Each cavity 400 is such that the connection pads of the antenna and its solder drops remain accessible (Figures 4 and 5). The various layers of plastic material are for example (see FIG. 7): a lower finish and protection layer 300 of the card, located under the support 210; the thickness of this lower layer of PVC is for example 0.1 mm thick after lamination; this layer has no cavity for receiving a module; a spacer layer 310, of PVC 0.4 mm thick after lamination, for example, located on the support 210; this spacer layer 310 has a cut corresponding to a cavity 400; a printing layer 320, of PVC 0.1 mm thick after lamination, for example, located on the spacer layer 310 and also comprising a cutout corresponding to a cavity 400; printing layer 320 comprises a cut corresponding to a cavity 400: a first finishing layer 330, of PVC, 0.05 mm thick after lamination, located above the second spacer layer 320 and on which include decorations to be visible on the map; this first finishing layer 330 comprises a cut corresponding to a cavity 400; a second upper finishing and protection layer 340 made of PVC, also 0.5 mm thick after lamination, is located on the printing layer 330; this second upper finish and protection layer 340 comprises a cutout corresponding to a cavity 400. The total thickness of all layers 300-340, and therefore the map is substantially 0.7 mm after lamination.
    [0005] A module 100 is then placed in each cavity 400 so that two connection tracks 110 dedicated to the connection of an antenna 200 to a chip 120 are each in relation to a connection pad 220. The regions of the module which are at the level of the solder drops are then heated to melt the solder 230 and solder the connection pads 220 of the antenna 200 to these connection tracks 110. This heating operation is carried out for example in same time as that of heating the points of heat-activatable adhesive for bonding each module 100 in its cavity 400. These points of heat-activatable adhesive are in fact very close to the solder drops placed on the connection pads 220 of the antenna 200. Due to the thickness of the module 100 and the height of the dome of a weld 230, when the solder melts, it wets the corresponding connection pad 220 (see Figure 8).
    [0006] FIG. 9 shows a chip card structure 500 having an antenna 200 either inserted as it is or resting on a support, already laminated to form a product ready to be embedded, by lamination between identical printing and finishing layers, or similar to those already described. This structure 500 comprises solder drops 230 at the 20 connection pads of the antenna 200, as well as an opening (countersunk or cut) for the production of the cavity 400. In a variant, a similar structure can be produced. from a wired antenna inserted into a support (for example by a technique of "wire embedding"). The ends of this antenna receive solder drops for welding the ends of this antenna to conductive tracks of the module. 30
    权利要求:
    Claims (6)
    [0001]
    REVENDICATIONS1. A method of manufacturing a smart card, comprising: providing a smart card module (100) having a substrate (101) having first and second major faces, with on the first side of the substrate, contacts (102) for a temporary electrical connection with a card contact reading device, and on the second face of the substrate, conductive tracks, this module also being provided with an electronic chip (120) connected to at least some contacts ( 102) and at least two conductor tracks dedicated to an antenna connection, providing an antenna (200) on an antenna support (210) for electromagnetic coupling with a cardless contact reading device, antenna (200) having a connection pad (220) respectively at each of its ends, the lamination of the antenna support (210) between plastic layers (300-340), and the placement of the module ( 100) in a cavity (400) formed in at least some of the plastic layers (310340), characterized in that it further comprises the deposition of welding drops (230) on each of the connection pads (220) of the antenna (200) or on the conductive tracks of the module (100) dedicated to an antenna connection and the heating of these drops, once the module is in place in the cavity (400), in order to weld each of the conductive tracks of the module (100) dedicated to an antenna connection respectively with a connection pad (220).
    [0002]
    2. The method of claim 1, wherein the solder drops (230) consist of a material having a melting temperature between 120 ° C and 230 ° C, and more preferably between 160 ° C and 190 ° C.
    [0003]
    3. The method of claim 2, wherein the heating of solder drops (230) is performed by applying to the module (100) a temperature of between 120 ° C and 250 ° C.
    [0004]
    4. Method according to one of claims 1 to 3, wherein the plastic layers are PVC.
    [0005]
    A chip card having a chip card module (100) having a substrate (101) having first and second major faces, with contacts (102) for a connection on the first face of the substrate (101). electrical terminal with a card contact reading device, and on the second face conductive tracks, this module also being provided with an electronic chip (120) connected to at least some contacts (102) and at least two conductive tracks dedicated to an antenna connection, an antenna (200) on an antenna support (210) for electromagnetic coupling with a non-contact card reading device, the antenna (200) comprising a connection pad (220) respectively at each of its ends, the antenna support (210) being laminated between plastic layers (300-340), and the module (100) being housed in a cavity (400) provided in least some of the layers of matter plastic era (310-340), characterized in that it further comprises - a drop of solder (230) between each of the two conductive tracks dedicated to an antenna connection and each of the connection pads (220) of the 'antenna. 30
    [0006]
    6. Structure (500) for a smart card comprising an antenna (200), for electromagnetic coupling with a non-contact card reading device, on a support, characterized in that each of the ends of the antenna (200) comprises a connection pad (220) provided with a solder drop (230).
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    AU2015326677A1|2017-05-18|
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    WO2016051092A1|2016-04-07|
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    法律状态:
    2015-08-27| PLFP| Fee payment|Year of fee payment: 2 |
    2016-04-01| PLSC| Publication of the preliminary search report|Effective date: 20160401 |
    2016-08-22| PLFP| Fee payment|Year of fee payment: 3 |
    2017-08-22| PLFP| Fee payment|Year of fee payment: 4 |
    2018-03-30| CA| Change of address|Effective date: 20180226 |
    2018-08-22| PLFP| Fee payment|Year of fee payment: 5 |
    2019-08-20| PLFP| Fee payment|Year of fee payment: 6 |
    2020-09-21| PLFP| Fee payment|Year of fee payment: 7 |
    优先权:
    申请号 | 申请日 | 专利标题
    FR1459310A|FR3026529B1|2014-09-30|2014-09-30|METHOD FOR MANUFACTURING CHIP CARD AND CHIP CARD OBTAINED THEREBY|FR1459310A| FR3026529B1|2014-09-30|2014-09-30|METHOD FOR MANUFACTURING CHIP CARD AND CHIP CARD OBTAINED THEREBY|
    BR112017006411A| BR112017006411A2|2014-09-30|2015-09-30|chip card and chip card manufacturing method obtained by said method|
    CN201580061286.7A| CN107209870B|2014-09-30|2015-09-30|Chip card manufacturing method and chip card obtained by the method|
    EP15788471.9A| EP3201843B1|2014-09-30|2015-09-30|Chip card manufacturing method, and chip card obtained by said method|
    AU2015326677A| AU2015326677A1|2014-09-30|2015-09-30|Chip card manufacturing method, and chip card obtained by said method|
    PCT/FR2015/052621| WO2016051092A1|2014-09-30|2015-09-30|Chip card manufacturing method, and chip card obtained by said method|
    US15/515,675| US10592796B2|2014-09-30|2015-09-30|Chip card manufacturing method, and chip card obtained by said method|
    KR1020177011453A| KR20170066486A|2014-09-30|2015-09-30|Chip card manufacturing method, and chip card obtained by said method|
    AU2018278977A| AU2018278977B2|2014-09-30|2018-12-13|Chip card manufacturing method, and chip card obtained by said method|
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